Nano Cut Device

Nanocut II, a second generation prototype experimental
machining instrument

The Nanocut II (a second-generation prototype), shown above, was used to make nanometer level cuts of a nominally brittle material, such as 4H-SiC, to determine the critical depth of cut at which ductile-regime machining can be performed1. The Nanocut II was designed to perform nanometer depth cuts based on the commanded depth by the operator as executed by the control program. The main components of this equipment are the frame, PZT tube (provides x, y and z displacement), capacitance gage (displacement feedback), force sensors, sample holder, tool holder, and hysteretic positioners. The PZT tube is used to position the sample relative to the tool, to establish the depth of cut. The Z (depth of cut) position is determined via the capacitance gage, and the two orthogonally placed force sensors measure the cutting and thrust forces. There are four dual axis flexures used in the device to decouple the cutting and thrust forces and to support the tool stage positioning wedge actuators.

The series of pictures below show former and current researchers that have worked on the Nanocut II device:

1Ductile to Brittle Transition (DBT) of a Single-Crystal 4H-SiC Wafer by Performing Nanometric Machining (read more)



Manufacturing Engineering

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