Furukawa Laser

Furukawa Laser (400 mW maximum power deliver)

The power delivery of this Furukawa laser ranges from 0W to 400mW with a wavelength of 1480 nm and a beam diameter of 10 microns. This IR diode laser has a Gaussian profile and has been used in combination with the Micro Laser Assisted Machining (µ-LAM) set-up1 to determine the effect of temperature and pressure in the µ-LAM process of several semiconductor materials, such as Silicon (Si) and Silicon Carbide (SiC)1.

1The Effects of Laser Heating on the Material Removal Process in Si and SiC Nanomachining



Manufacturing Engineering

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