
John Patten, Ph.D.
Industrial and Manufacturing Engineering &
Department of Manufacturing Engineering |
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Semiconductor Machining at the Micro-Nano Scale, 2007: ISBN: 978-81-7895-301-4 Editors: Jiwang Yan and John Patten; Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh
Ductile Regime Nanomachining of Single-Crystal Silicon Carbide, John Patten
Wei Gao Kudo Yasuto, Journal of Manufacturing Science and Engineering AUGUST 2005, Vol. 127 / 1
"High Pressure Phase Transformation of Silicon Nitride", 2003 Appl. Phys. Lett., J. Patten, Robert Nemanich, Jennifer Huenin, et al.
"Study of Ductile Machining of Silicon Nitride", 2001, T.G. Kumbera, J.A. Patten, H.P. Cherukuri, C.J. Brand, T.D. Marusich, Int. J. of Machining Science and Technology, Vol.5, No. 3, 341-352.
"Extreme Negative Rake Angle Technique for Single Point Diamond Nano-Cutting of Silicon", 2001, Precision Engineering, J.A. Patten, W. Gao, Vol.25, No.2, 165-167.
"On the Development of Surface Temperatures in Precision Single-point Diamond Abrasion of Semi-conductors", 1997, H. A. Abdel-Aal, S.T. Smith, J.A. Patten, Int. Comm. Heat Mass Transfer, Vol. 24, No. 8, pp. 1131-1140.
"Thermal Imaging with Near-Field Microscope", 1997, B.D. Boudreau, J. Raya, R. Hocken, S. Patterson, and J. Patten. Rev. Sci. Inst. Vol. 68, pp. 3096-3098.
"High Pressure Phase Transformation Analysis and Molecular Dynamics Simulations of Single Point Diamond Turning of Germanium", 1996, J.A. Patten. PhD Dissertation, NCSU.