The Moldflow Center for Design Excellence was formally established in 1998. However, Moldflow's relationship with WMU goes back to the early 80s.

Since the mid-1990s WMU conducted research in the production of more-efficient molds using high strength, high-thermal conductivity copper alloys.

Because the cooling relationship is difficult to predict mathematically, WMU has made its data available to Moldflow for use in software development. WMU's input has had some impact on the software. Only a small handful of universities perform research that actually impacts Moldflow's code.

As part of the Center's agreement, Moldflow donated $2.9 million worth of computer hardware and software to the College. The Center currently houses seven workstations and Moldflow has contributed over $15 million to the College in software and hardware donations.